PLACA BASE GIGABYTE X570 I AORUS PRO WIFI MITX 2XDDR4

Procesador. AMD Socket AM4, support for: 3rd Generation AMD Ryzen™ processors/ 2nd Generation AMD Ryzen™ processors/ 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/ AMD Ryzen™ with Radeon™ Vega Graphics processors. . Chipset AMD X570. . Memoria.

3rd Generation AMD Ryzen™ processors:. Support for DDR4 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz memory modules
2nd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors:. Support for DDR4 3600(O.C.) / 3400(O.C.) / 3333(O.C.) / 3200(O.C.) / 2933 / 2667 / 2400 / 2133 MHz memory modules
2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory
Arquitectura de memoria Dual Channel
Soporte para módulos de memoria ECC Un-buffered DIMM 1Rx8/2Rx8
* ECC is only supported with AMD Ryzen™ PRO-series CPU.
Soporte para módulos de memoria non-ECC Un-buffered DIMM 1Rx8/2Rx8
Soporte para módulos de memoria Extreme Memory Profile (XMP)

. . Gráfica Integrada. Procesador gráfico integrado:.

1 x DisplayPort, soporta una resolución máxima de 4096x2304@60 Hz
* Soporte para la versión 1.2 de DisplayPort.
2 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
* Support for HDMI 2.0 version, HDCP 2.2, and HDR.

. . Capacidad para 3 pantallas al mismo tiempo. Maximum shared memory of 16 GB. Nota: For 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors only.. Audio.

Realtek® ALC1220-VB codec
* The back panel line out jack supports DSD audio.
Audio de alta definición
2/4/5.1/7.1-channel
* Para configurar el audio de 7.1 canales, tiene que utilizar un módulo frontal de audio HD y activar la función de múltiples canales de audio a través del controlador de audio.

. LAN. Chip Intel® GbE LAN (10/100/1000 Mbit). . Módulo de comunicaciones inalámbricas.

Wi-Fi 802.11a/b/g/n/ac/ax, supporting 2.4/5 GHz Dual-Band
BLUETOOTH 5.0
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
* La tasa de datos real puede variar según el equipo y el entorno.

. . Zócalos de Expansión. Integrated in the CPU (PCIEX16):.

3rd Generation AMD Ryzen™ processors:. 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)
2nd Generation AMD Ryzen™ processors:. 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16 (PCIEX16)
2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors:. 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX16)

. Chipset:.

1 x conector M.2 Socket 1 para la comunicació inalámbrica(M2_WIFI)

. . Interfaz de almacenamiento. Integrated in the CPU (M2A_SOCKET):. 3rd Generation AMD Ryzen™ processors:. 1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 4.0 x4/x2 SSD support). 2nd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors:. 1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 3.0 x4/x2 SSD support). . Integrated in the Chipset (M2B_SOCKET):. 1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280 SATA and PCIe* x4/x2 SSD support). * For 3rd Generation AMD Ryzen™ processors only.. 4 x conectores SATA 6 Gb / s. Soporta RAID 0, RAID 1, y RAID 10. . USB. Chipset:. 1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support. 1 x USB 3.2 Gen 2 Type-A ports (red) on the back panel. 2 x USB 3.2 Gen 1 ports available through the internal USB header. 2 x puertos USB 2.0/1.1 disponibles a través del conector USB interno. . Integrated in the CPU:. 4 x USB 3.2 Gen 1 ports on the back panel. . Conectores Internos E/S. 1 x 24-pin ATX main power connector. 1 x conector de alimentación ATX 12V 8-pin. 1 x conector del ventilador de la CPU. 2 x cabeceras para ventilador del sistema. 1 x addressable LED strip header. 1 x RGB LED strip header. 4 x conectores SATA 6 Gb / s. 2 x conectores M.2 Socket 3. 1 x front panel header. 1 x front panel audio header. 1 x conector para altavoz. 1 x USB 3.2 Gen 1 header. 1 x conector USB 2.0/1.1. 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only). La función TPM es opcional según las diferentes políticas locales. 1 x Clear CMOS jumper. . Panel E/S Trasero. 1 x DisplayPort. 2 x puerto HDMI. 1 x USB 3.2 Gen 2 Type-A port (red). 4 x USB 3.2 Gen 1 ports. 1 x USB Type-C™ port, with USB 3.2 Gen 2 support. 1 x Q-Flash Plus button. 1 x Puerto RJ-45. 2 x conectores de antena SMA (2T2R). 3 x audio jacks. . Formato. Factor de forma Mini-ITX: 17.0cm x 17.0cm

CHIPSET: AMD X570
FORMATO: MINI ITX
HDMI: SI
IMAGEN SALIDA: GRAFICOS EN CPU/ HDMI, DISPLAY PORT
MEMORIA MAXIMA: 64 GB
MICROPROCESADOR INTEGRADO: NO
MULTI-GRAFICA: NO
N BANCOS DE MEMORIA: 2
N CONEXIONES SATA: 4
N USB 2.0: 1 INTERNO
N USB 3.0: 4 TRASEROS, 1 INTERNO
N USB 3.1: 1 TRASERO , 1 TIPO C TRASERO
PCI: 1 PCIe x16
RAID: SI
SATA 6GB/s: 4
SOCKET: AMD AM4
TECNOLOGIA DE MEMORIA: DDR4
TIPO DE RAID: 0,1,10
TIPO MEMORIA: 2 x DDR4 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz
USB 3.0: SI
USB3.0 INTERNO: SI
USB3.1 INTERNO: NO